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Dresden University of Technology
Institute of Electromechanical and
Electronic Design

 

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Dipl.-Ing. Steve Bigalke
Ph.D. Student

German 



Publications:

M. Thiele, S. Bigalke und J. Lienig, "Electromigration Analysis of VLSI Circuits Using the Finite Element Method," In: VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things. Hrsg. von M. Maniatakos, I. Elfadel, M. S. Reorda, F. Ugurdag, J. Monteiro und R. Reis. IFIP International Federation for Information Processing, Springer Nature Switzerland AG, 2019, DOI: 10.1007/978-3-030-15663-3_7 (bibtex)
S. Bigalke, J. Lienig, G. Jerke, J. Scheible and R. Jancke, "The Need and Opportunities of Electromigration-Aware Integrated Circuit Design," In Proc. of 2018 Int. Conf. on Computer Aided Design (ICCAD), Nov. 2018, pp. 96:1--96:8, DOI: 10.1145/3240765.3265971 (bibtex)
S. Bigalke and J. Lienig, "FLUTE-EM: Electromigration-optimized net topology considering currents and mechanical stress," In Proc. of 26th IFIP/IEEE Int. Conf. on Very Large Scale Integration (VLSI-SoC), Oct. 2018, pp. 225--230, DOI: 10.1109/VLSI-SoC.2018.8644965 (bibtex)
S. Bigalke, T. Casper, S. Schöps and J. Lienig, "Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization," In Proc. of 2018 14th Conf. on Ph.D. Research in Microelectronics and Electronics (PRIME), Jul. 2018, pp. 89--92, DOI: 10.1109/PRIME.2018.8430323 (bibtex)
M. Thiele and S. Bigalke and J. Lienig, "Exploring the use of the finite element method for electromigration analysis in future physical design," In Proc. of 2017 IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), Oct. 2017, pp. 1--6, DOI: 10.1109/VLSI-SoC.2017.8203466 (bibtex)
S. Bigalke and J. Lienig, "Electro-, Stress- and Thermomigration: Three Forces, One Problem," Poster and Demonstrator at University Booth of Design, Automation and Test Conference and Exhibition (DATE), Mar. 2016, Dresden.
S. Bigalke and J. Lienig, "Load-aware redundant via insertion for electromigration avoidance," In Proc. of 2016 ACM International Symposium on Physical Design (ISPD), Apr. 2016, pp. 99--106, DOI: 10.1145/2872334.2872355 (bibtex)
S. Bigalke, "Berücksichtigung von Elektromigration im zukünftigen Layoutentwurf," Diplomarbeit, 2014, Technische Universität Dresden.
S. Bigalke, "Aufbau eines 3D-Bilderfassungssystems," Studienarbeit, 2012, Technische Universität Dresden.


Presentations:

S. Bigalke "Halbleiter-Chips: Entwurf der Grundbausteine einer digitalen Welt," Uni-Tag, Mai 2019, Technische Universität Dresden.
S. Bigalke, J. Lienig, G. Jerke, J. Scheible and R. Jancke, "The Need and Opportunities of Electromigration-Aware Integrated Circuit Design," 2018 Int. Conf. on Computer Aided Design (ICCAD), Nov. 2018, California (USA).
S. Bigalke, "Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization," 2018 14th Conf. on Ph.D. Research in Microelectronics and Electronics (PRIME), Jul. 2018, Prague (CZ).
S. Bigalke und A. Krinke, "Layoutentwurf integrierter Schaltungen: Eine Vorstellung der IFTE-Werkzeuge," Institut für Feinwerktechnik und Elektronik-Design, Jun. 2017, Technische Universität Dresden.
S. Bigalke, "Digitallayoutsynthese: Akademische Werkzeuge für Lehre und Forschung?," Fachgruppe: Entwurf des Layouts von Schaltungen, Mär. 2017, Leibniz Universität Hannover.
S. Bigalke, "Halbleiter-Chips: Entwurf der Grundbausteine einer digitalen Welt," Dresdner Lange Nacht der Wissenschaften, Mai 2016, Dresden.
S. Bigalke, "Load-Aware Redundant Via Insertion for Electromigration Avoidance," International Symposium on Physical Design (ISPD), Apr. 2016, California (USA).
S. Bigalke, "Roadmap and Current Research on Considering Electromigration in Physical Design," Research Training Group of Nano- and Biotechnologies for Packaging of Electronic Systems, Mai 2015, Dresden University of Technology.
S. Bigalke, "Berücksichtigung von Elektromigration im digitalen Layoutentwurf," Institut für Feinwerktechnik und Elektronik-Design, Okt. 2014, Technische Universität Dresden.
S. Bigalke, "Future Prevention of Electromigration in Complex Digital Designs," Research Training Group of Nano- and Biotechnologies for Packaging of Electronic Systems, Jun. 2014, Dresden University of Technology.


Organisations:

S. Bigalke, M. Gehlhar, S.-C. Yang, J. Murawski, Y. Ge, "Alumni Reunion," Workshop of the 1401 Research Training Group of Nano- and Biotechnologies for Packaging of Electronic Systems, Apr. 2015, Schloss Eckberg, Dresden.
S. Bigalke, M. Gehlhar, M. Rio, N. Steinke, S. Osmolovskyi, V. Hoffmann, "Bioelectronics inside," Workshop of the 1401 Research Training Group of Nano- and Biotechnologies for Packaging of Electronic Systems, Nov. 2014, Schloss Wackerbarth, Radebeul.


Biography:

03/2014 Ph.D. Student, TU Dresden
03/2013 - 08/2013 Internship, Georgia Institute of Technology
10/2012 - 02/2013 ERASMUS-Semester, Loughborough University
10/2010 - 09/2012 Student Assistant, TU Dresden
10/2008 - 02/2014 Study of Electronic Engineering, TU Dresden

 

 

 

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Last Update: 20.01.2023