S. Osmolovskyi, J. Knechtel, I.L. Markov, J. Lienig, "Optimal Die Placement for Interposer-Based 3D ICs," in Proc. of the 23rd Asia and South Pacific Design Autom. Conf. (ASP-DAC 2018), pp. 513-520, Jan. 2018 (PDF)

S. Osmolovskyi, J. Lienig, "Physical Design Challenges and Solutions for Interposer-Based 3D Systems," GMM-Fachbericht 274, in Reliability by Design Conf. (ZuE 2017), VDE Verlag, pp. 97-104, Sept. 2017 (PDF)

J. Knechtel, J. Lienig, S. Osmolovskyi, "3D-Floorplanning für hochparallele Verbindungsstrukturen", in Tagungsband Dresdner Arbeitstagung Schaltungs- und Systementwurf, pp. 16-20, 2014

R. Schwerz, M. Roellig, S. Osmolovskyi, K.-J. Wolter, "Reliability assessment of discrete passive components embedded into PCB core", in Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1–7, 2014

S. Osmolovskyi, R. Schwerz, K.-J. Wolter, "Parameters of the manufacturing process and reliability of embedded components", in 36th International Spring Seminar on Electronics Technology (ISSE), pp. 64–69, 2013