Homepage Dipl.-Ing. Johann Knechtel

Dresden University of Technology
Institute of Electromechanical and
Electronic Design

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Dipl.-Ing. Johann Knechtel
Ph.D. Student

German

Research Interests:

VLSI Physical Design Automation for 3D Integration

Biography:

Johann Knechtel received the M.Sc. (diploma) in Information Systems Engineering from Dresden University of Technology, Germany, in 2010. Currently he is a Ph.D. candidate at the Institute of Electromechanical and Electronic Design, Dresden University of Technology. He is also a fellow and Ph.D. scholarship holder of the research group Nano- and Biotechnologies for Packaging of Electronic Systems, funded by the German Research Foundation. In 2010, he was a Visiting Research Student with the Department of Electrical Engineering and Computer Science, University of Michigan, USA. During that time, he received a scholarship from the German Academic Exchange Service. His research interests include VLSI Physical Design Automation with emphasis on 3D Integration.

Publications:

J. Knechtel, I. L. Markov, J. Lienig, "Assembling 2-D Blocks into 3-D Chips," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(2):228-241, 2012 (PDF)

R. Fischbach, J. Lienig, J. Knechtel, "Investigating Modern Layout Representations for Improved 3D Design Automation," in Proc. of the Great Lakes Symposium on VLSI, pp. 337-342, 2011 (PDF)

J. Knechtel, I. L. Markov, J. Lienig, "Assembling 2D Blocks into 3D Chips," in Proc. of the International Symposium on Physical Design, pp. 81-88, 2011 (PDF)

Contact:

Phone	+49 351 463 39612
Fax	+49 351 463 37183
E-Mail	johann.knechtelifte.de
Letters	TU Dresden
	Institut für Feinwerktechnik und Elektronik-Design
	01062 Dresden
Office	Barkhausenbau
	Helmholtzstraße 18
	Room II/47

Impressum

Last update: 01/30/2012