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Dresden University of Technology
Institute of Electromechanical and
Electronic Design

 

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Dr.-Ing. Johann Knechtel
Former Researcher, now with New York University Abu Dhabi

German 

 

 

 

Research Interests:

 

VLSI Physical Design Automation for 3D Integration

 

Biography:

 

Johann Knechtel received the M.Sc. in Information Systems Engineering (Dipl.-Ing.) in 2010 and the Ph.D. in Computer Engineering (Dr.-Ing.) in 2014, both from Dresden University of Technology, Germany.

 

Dr. Knechtel is currently a Postdoctoral Associate at the DfX Lab, New York University Abu Dhabi, UAE. From 2010 to 2014, he was a Research Associate and Scholar with the DFG Research Training Group Nano- and Biotechnologies for Packaging of Electronic Systems, and a Ph.D. Student at the Institute of Electromechanical and Electronic Design, Dresden University of Technology. In 2012, he was a Research Assistant with the Dept. of Computer Science and Engineering, Chinese University of Hong Kong, China. In 2010, he was a Visiting Research Student with the Dept. of Electrical Engineering and Computer Science, University of Michigan, USA.

 

Publications (English only):

  • J. Knechtel, O. Sinanoglu, I. A. M. Elfadel, J. Lienig, C. C. N. Sze, "Large-Scale 3D Chips: Challenges and Solution for Design Automation, Testing, and Trustworthy Integration," in IPSJ Transactions on System LSI Design Methodology (TSLDM), Invited paper, Vol. 10, pp. 45-62, 2017 (PDF)

  • J. Knechtel, O. Sinanoglu, "On Mitigation of Side-Channel Attacks in 3D ICs: Decorrelating Thermal Patterns from Power and Activity," in Proc. Design Automation Conference, 2017 (PDF)

  • J. Knechtel, J. Lienig, "Physical Design Automation for 3D Chip Stacks – Challenges and Solutions," in Proc. International Symposium on Physical Design, Invited paper, pp. 33-40, 2016 (PDF)

  • P. Budhathoki, J. Knechtel, A. Henschel, I. A. M. Elfadel, "Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias," in 3D Stacked Chips – From Emerging Processes to Heterogeneous Systems, I. A. M. Elfadel, G. Fettweis (eds.), Springer, ISBN 978-3-319-20480-2, 2016 (Link)

  • J. Knechtel, J. Lienig, C.C.N. Sze, "Challenges and Future Directions of 3D Physical Design," in Physical Design for 3D Integrated Circuits., A. Todri-Sanial, Ch. S. Tan (eds.), CRC Press, ISBN 978-1-498-71036-7, pp. 357-386, 2015 (Link)

  • J. Knechtel, E. F. Y. Young, J. Lienig, "Planning Massive Interconnects in 3D Chips," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 34, No. 11, pp. 1808-1821, 2015 (PDF)

  • J. Knechtel, "Interconnect Planning for Physical Design of 3D Integrated Circuits," PhD dissertation, in Fortschritt-Berichte VDI Reihe 20 Nr. 445, VDI-Verlag Düsseldorf, ISBN 978-3-18-345520-1 ISSN 0178-9473, 2014 (link to hardcopy, citable link to softcopy)

  • J. Knechtel, E. F. Y. Young, J. Lienig, "Structural Planning of 3D-IC Interconnects by Block Alignment," in Proc. Asia South Pacific Design Automation Conference, pp. 53-60, 2014 (PDF)

  • P. Budhathoki, J. Knechtel, A. Henschel, I. Elfadel, "Integration of Thermal Management and Floorplanning Based on Three-Dimensional Layout Representations," in Proc. International Conference on Electronics, Circuits, and Systems, pp. 962-965, 2013 (PDF)

  • R. Fischbach, J. Knechtel, J. Lienig, "Utilizing 2D and 3D Rectilinear Blocks for Efficient IP Reuse and Floorplanning of 3D-Integrated Systems," in Proc. International Symposium on Physical Design, pp. 11-16, 2013 (PDF)

  • J. Knechtel, I. L. Markov, J. Lienig, M. Thiele, "Multiobjective Optimization of Deadspace, a Critical Resource for 3D-IC Integration," in Proc. International Conference on Computer-Aided Design, pp. 705-712, 2012 (PDF)

  • J. Knechtel, I. L. Markov, J. Lienig, "Assembling 2-D Blocks into 3-D Chips," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 31, No. 2, pp. 228-241, 2012 (PDF)

  • R. Fischbach, J. Lienig, J. Knechtel, "Investigating Modern Layout Representations for Improved 3D Design Automation," in Proc. Great Lakes Symposium on VLSI, pp. 337-342, 2011 (PDF)

  • J. Knechtel, I. L. Markov, J. Lienig, "Assembling 2D Blocks into 3D Chips," in Proc. International Symposium on Physical Design, pp. 81-88, 2011 (PDF)

Contact:

 

Phone

+49 351 463 39612

Fax

+49 351 463 37183

E-Mail

johann.knechtelifte.de

Letters

TU Dresden

 

Institut für Feinwerktechnik und Elektronik-Design

 

01062 Dresden

Office

Barkhausenbau

 

Helmholtzstraße 18

 

Room II/47

 

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Last update: May 13, 2017