Dresden University of Technology |
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Research Focus 3D Physical Design
Algorithms and Data Structures Three-dimensional integrated circuits
(3D-ICs) make use of advanced manufacturing methodologies such that multiple
active chips can be stacked. Integrating chips in the third dimension allows
for increased packing densities, shorter interconnects and heterogeneous
systems. However, the commercial application of 3D-ICs is still notably
impeded by design and manufacturing challenges.
Research Approaches:
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New approaches for physical design optimization and
modeling of 3D-ICs under consideration of vertical interconnects, the
through-silicon vias (TSVs)
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Representation of three-dimensional circuits in
suitable data structures
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Optimized reuse of classical 2D-IP-blocks for 3D-IC
design Selected Results:
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A new design methodology for assembling 2D-IP-blocks
in 3D-ICs
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A multiobjective layout-optimization approach for
guided TSV planning
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An extended data structure for optimized planning of
inter-die and intra-die connects in 3D-ICs
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A new data structure, enabling floorplanning
of complex-shaped rectilinear 2D and 3D blocks
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A methodology for applied solution-space
investigations of data structures Schematic overview on selected methodologies Downloads: Please consider
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Last Update: 07/15/2015 |
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