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Dresden University of Technology
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Research Focus

Design automation for interposer-based 3D ICs

 

Interposer-based 3D ICs—also known as 2.5D ICs—promise higher yield and better heat dissipation over classical 2D ICs. Such 3D ICs are currently commercially available in a few products, like FPGAs and GPUs, and they are viable contenders for the next-generation chip market. However, the designing of these products requires some notable manual intervention for placement, simulation, verification, etc.; available tools are still inadequate according to academia and industry experts.

 

 

Structure of interposer-based 3D ICs

 

To address this issue, we are developing the automated design methodologies for interposer-based 3D ICs, including approaches for die placing, interposer routing, thermal analysis and pin assignment.

Read our overview of design challenges for interposer-based 3D ICs

 

Research Interests

Overview of the selected design methodologies

 

Optimal Die Placement on the Interposer


We developed an effective method for optimal wirelength-driven die placement of interposer-based 3D ICs.

Our key ideas are to leverage the constraint-satisfaction problem (CSP) formalism in combination with a branch-and-bound (B&B) algorithm, and to develop several novel techniques for early identification and pruning of unpromising configurations. Such pruning techniques dramatically, yet accurately, confine the solution space and quickly rule out unpromising placements. Thus, we obtain optimal placement solutions in significantly shorter runtime than prior art, and we can optimally handle larger problem instances than prior art.

Related publication

 

 

Downloads


Binary of the optimal interposer placement tool (supports parallel execution):

Please consider this software experimental
Binary compiled on Ubuntu 16.04 with gcc 5.4.0 (dynamically linked)
Statically linked binary compiled on Ubuntu
Benchmarks

For information regarding execution, settings and command line parameters, please refer to the attached with the binary README file.

For binary compiled on other platforms, please contact us (specify your distribution and version of C libraries or/and compiler).

THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE DISCLAIMED. IN NO EVENT SHALL THE COPYRIGHT OWNER OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.

 

Contact:

 

M. Sc. Sergii Osmolovskyi, Prof. Jens Lienig

 

 Impressum

Last Update: 28.09.2018