Dr.-Ing. Andreas Krinke
Scientific Assistant

Research:

Current projects:

Previous projects:

Teaching:
Practical course: Physical Design and Physical Design Automation (6th Semester)
Tutorial: Algorithms for VLSI Physical Design Automation (7th Semester)
Publications:

R. Fischbach, R. Frevert, A. Krinke, S. Wicht, J. Lienig
Design for Manufacturing and Assembly for Heterogeneous Integration Using Micro-Transfer Printing [PDF]
Proc. of the 27th International Symposium on Quality Electronic Design (ISQED 2026), San Francisco, CA, April 2026.

J. Knechtel, S. Rothe, R. Fischbach, M. Thiele, T. Meister, A. Krinke
Invited: From Evolutionary Algorithms to Analog Design, Electromigration, 3D Integration, and Beyond: On Jens Lienig's Contributions to Advance Physical Design [PDF, ACM]
Proc. of the 2026 International Symposium on Physical Design (ISPD'26), Bonn, Germany, March 2026.

P. Näke, F. Stein, A. Krinke, J. Lienig
Efficient Architecture Evaluation and Generation of Automotive Wiring Harnesses [PDF, DOI, IEEE Xplore]
Proc. of the IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific), Singapore, pp. 1-5, November 2025.

N. Arnold, A. Krinke, M. Dietrich, J. Lienig
An Open-Source Tool for FEM Modeling of Bent Flexible Circuits [PDF, DOI, IEEE Xplore]
IEEE Journal on Flexible Electronics, vol. 4, no. 8, pp. 333-341, August 2025.

N. Arnold, A. Krinke, M. Dietrich, J. Lienig
Please, Fold the Line: Designing Flexible Electronics Using Open-Source Software [PDF, DOI, IEEE Xplore]
IEEE International Flexible Electronics Technology Conference (IFETC 2024), DOI: 10.1109/IFETC61155.2024.10771875, Bologna, Italy, pp. 1-3, September 2024.

A. Krinke, R. Fischbach, J. Lienig
Layout Verification Using Open-Source Software [PDF, DOI, ACM]
Proc. of the ACM 2024 International Symposium on Physical Design (ISPD'24), DOI: 10.1145/3626184.3635289, Taipeh, Taiwan, pp. 137-142, March 2024.

A. Hirler, U. Abelein, M. Büttner, R. Fischbach, G. Jerke, A. Krinke, S. Simon
Mission Profile Clustering Using a Universal Quantile Criterion [PDF, IEEE Xplore]
IEEE International Reliability Physics Symposium (IRPS 2022), DOI: 10.1109/IRPS48227.2022.9764542, Dallas, USA, pp. 2C.1-1 et seqq., March 2022.

A. Krinke, S. Rai, A. Kumar, J. Lienig
Exploring Physical Synthesis for Circuits based on Emerging Reconfigurable Nanotechnologies [PDF]
Proc. of the International Conference On Computer-Aided Design (ICCAD 2021), Online Event / Munich, Germany, pp. 1-9, November 2021.

C. Sohrmann, R. Fischbach, A. Krinke, T. Nirmaier, V. Meyer zu Bexten, G. Jerke, J. Novacek
Towards a Standardized Format for Automotive Mission Profiles [PDF, VDE Verlag, IEEE Xplore]
GMM-Fachbericht 99: Automotive meets Electronics (AmE 2021), VDE Verlag, ISBN: 978-3-8007-5487-8, Online Event, pp. 39-44, March 2021.

A. Krinke
Constraint Propagation for Analog and Mixed-Signal Integrated Circuit Design [VDI Verlag]
Dissertation, Fortschritt-Berichte VDI, series 20, number 474, VDI Verlag, Düsseldorf, ISBN: 978-3-18-347420-2, 2020.

A. Krinke, T. Horst, G. Gläser, M. Grabmann, T. Markus, B. Prautsch, U. Hatnik, J. Lienig
From Constraints to Tape-Out: Towards a Continuous AMS Design Flow [PDF, DOI, IEEE Xplore]
Proc. of the 22nd International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2019), Cluj-Napoca, Romania, pp. 1-10, April 2019.

A. Krinke, L. Lei, J. Lienig
Predictive System-Level Constraint Verification and Optimization [PDF, IEEE Xplore]
ITG-Fachbericht 274: Reliability by Design (ZuE 2017), VDE Verlag, ISBN: 978-3-8007-4444-2, Cottbus, Germany, pp. 40-45, September 2017.

A. Krinke, G. Jerke, J. Lienig
Entwurf analoger und analog-digitaler ICs: Kenne die Grenzen [PDF]
Elektronik, WEKA Fachmedien, 4/2016, p. 8, February 2016.

A. Krinke, G. Jerke, J. Lienig
Constraint Propagation Methods for Robust IC Design [PDF, IEEE Xplore]
GMM-Fachbericht 83: Reliability by Design (ZuE 2015), VDE Verlag, ISBN: 978-3-8007-4071-0, Siegen, Germany, pp. 7-14, September 2015.

A. Krinke, G. Jerke, J. Lienig
Adaptive Data Model for Efficient Constraint Handling in AMS IC Design [PDF, DOI, IEEE Xplore]
Proc. of the 20th IEEE International Conference on Electronics, Circuits and Systems (ICECS 2013), ISBN: 978-1-4799-2451-6, Abu Dhabi, UAE, pp. 285-288, December 2013.

A. Krinke, M. Mittag, G. Jerke, J. Lienig
Extended Constraint Management for Analog and Mixed-Signal IC Design [PDF, DOI, IEEE Xplore]
Proc. of the 21th European Conference on Circuit Theory and Design (ECCTD 2013), ISBN: 978-3-00-043430-3, Dresden, Germany, September 2013.

A. Krinke, M. Mittag, G. Jerke, J. Lienig
Propagierung und Transformation von Randbedingungen für den AMS-IC-Entwurf [PDF]
Proc. edaWorkshop 13, VDE Verlag, ISBN: 978-3-8007-3499-3, Dresden, Germany, pp. 39-44, May 2013.

M. Mittag, A. Krinke, G. Jerke, W. Rosenstiel
Hierarchical Propagation of Geometric Constraints for Full-Custom Physical Design of ICs [PDF, DOI, IEEE Xplore]
Proc. Design, Automation and Test in Europe (DATE 2012), Dresden, Germany, pp. 1471-1474, March 2012.

A. Krinke, J. Lienig
An Ontology for Constraints in Custom IC Design [PDF, DOI, IEEE Xplore]
Proc. of the 20th European Conference on Circuit Theory and Design (ECCTD 2011), ISBN: 978-1-4577-0616-5, Linköping, Sweden, pp. 343-345, August 2011.

A. Krinke, R. E. Stephan
DEF File Export Considering Overlapping Structures [Folien]
CDNLive! 2011, May 3-5 2011, Munich, Germany.

A. Krinke, J. Lienig
Neuartige Entwurfsmethodik zur Berücksichtigung des IR-Drop bei der Power-Verdrahtung analoger Schaltungen [PDF]
Tagungsband Dresdner Arbeitstagung Schaltungs- und Systementwurf (DASS 2011), Fraunhofer Verlag, ISBN: 978-3-8396-0259-1, pp. 42-47, Mai 2011.

Contact:
Phone +49 351 - 463 3 47 05
Fax +49 351 - 463 3 71 83
E-Mail andreas.krinke [at] tu-dresden.de
Letters TU Dresden
Institut für Feinwerktechnik und Elektronik-Design
D-01062 Dresden
Visitors Barkhausenbau
Helmholtzstraße 18
Office II/27

  Letzte updated: 2026-05-26